Laser patterning removal processing for thin films.
1. Example of patterning removal processing with a thickness of 0.04 on an aluminum thin film on PET. 2. Example of removal processing with a groove width of 0.03 on a conductive film on a glass substrate.
The laser processing technology, which minimizes thermal impact, enables film removal processing that minimizes damage to the substrate. Since the removal pattern can be changed through adjustments in CAD programming, we can flexibly accommodate requests for pattern changes.
